Business

Support customers’innovation with our technology and prepare for future generation based on technology.

Semiconductor

Material / Process used for semiconductor

High/low-frequency EMI Shielding material
for semiconductors
(multiple patents applied)

Demands for EMI(Electro-Magnetic Interference) shielding technologies between various semiconductor packages are increasing, as IT hardware such as 5G, self-driving, IoT, AI, AR, and VR are showing high performance. In particular, telecommunication modules such as smartphones, smartwatches, antennas, and wireless charging modules require near-field shielding as well as far-field shielding under both low and high frequencies. Ntrium is the first and only company in the world that provides EMI shielding solution in semiconductors at both low-frequency and high-frequency.
Ntrium provides a customized EMI shielding solution according to the customer’s semiconductor package, board and system structure using its own unique material technology (multiple patents issued).
Ntrium's EMI shielding materials at both high and low frequency have world-class shield effectiveness and reliability through the collaboration with global leading semiconductor companies.

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Thermal Interface Material

As 5G, which is a high-speed wireless data communication service, is in full swing, self-driving, IoT and AI convergence services that are linked to this are approaching the immediate reality. As a result, the calculating speed of semiconductor is getting faster and the memory bandwidth is also expanding at a very fast rate. However, due to the increasing speed and transmission of data, high-temperature has become one of the serious problems in various logic chips and is causing failure in memory chips. Ntrium developed high thermal-conductive materials to provide customized thermal interface solutions optimized for new package structures. Ntrium’s high thermal-conductive materials have been recognized of its world-class quality in stable application, thermal conduction characteristics, thermal expansion matching with the substrate, and its reliability.

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