Product

We continue to expand line-up of our customized products including EMI shielding materials and thermal interface materials.

Film

Shatter Proof Film

Structure

Structure

Structure

Features

  • Excellent shatter proof performance
  • Ultra-High Transparency
  • Good bonding for materials such as glass and polycarbonate and acrylic

Specifications

Item Unit Value Test Method
Total Thickness ㎛ 75±3 Thickness Gauge
Hardness(without OCA) N/25mm Min.16 ASTM D3363
Mitsubishi Pencil
Cross Hatch Cut - 100/100 Cross-cut Test
Transmittance % ≥ 92 ASTM D1003
Haze % 0.7 NDH-5000

PC-PET Film

Structure

Structure

Structure

Features

  • Integrated composite film of PC/PET
  • Excellent thermal formation
  • Work performance and speed compared to PC/PMMA

Specifications

Item Unit Standard Test Method
Total Thickness ㎛ 600±20 Thickness Gauge
Visual Light Transmittance % 92 ASTM D1003
Haze % ＜0.4 NDH-5000
Hardness - HB ASTM D3363
Mitsubishi Pencil
Heat Shrinkage % 0 ~ 1 -

CBF(Conductive Bonding Film)

Structure

Structure

Structure

Features

  • Excellent EMI shield effect
  • Strengthening GND
  • Outstanding adhesion to stiffener(SUS, FR-4, PI)
  • Applicable to lead-free reflow-soldering
  • Excellent conductivity based on Ag/Cu

Specifications

Properties Unit Standard Test Method
Thickness Conductive
Adhesive Layer		 ㎛ 60±6 Micrometer
Protect film ㎛ 50±5 Micrometer
Shield effect dB ＞45 Network Analyzer(1GHz)
Surface Resistance mΩ ＜300 Itself after hot press
Peel Strength Poly imide(PI) kgf/cm ＞1.0 JIS C 6471 8.1
Copper(Cu) kgf/cm ＞1.0
Conductivity(GND Ø 1.5mm) Ω ＜1.0 Ntrium Method
Solder Resistane(260℃) - Pass JIS C 6471 9.3

AR(Anti-reflection) Film

Structure

Structure

Structure

Features

  • Its appearance is good and excellent low reflection characteristics
  • Ultra-High Transparecy

Specifications

Item Unit Standard Test Method
Total Thickness ㎛ 50±2 Thickness Gauge
Hardness - H ASTM D3363
Mitsubishi Pencil
WVTR gm/(m2) day 3 ~ 5 -
Visual Light Transmittance % ≥ 95 ASTM D1003
Haze % ＜0.8 NDH-5000
Antistatic layer (Upper) Ω/ㅁ 109 -
Antistatic layer (Lower) Ω/ㅁ 109 -
Heat Shrinkage % within 1.6 MD
within 0.8 TM

Glass Dicing Film

Structure

Structure

Structure

Features

  • After peeling, there was no afterimage and adhesive transition
  • Excellent adhesion to substrate due to excellent initial adhesion
  • Excellent peel strength

Specifications

Properties Unit Standard Test Method
Thickness Base Film ㎛ 50±2 Thickness Gauge
Acryl Adhesive 15±2
Release 50±2
Adhesive Strenght Before UV gf/inch 1200±200 ASTM D3330, SUS UV lights : 350mj/cm2
After UV 10
Transmittance % ≥ 90 ASTM D1003
Haze ≤ 2 NDH-5000
Tensile strength Above 8.5 Tensile testing machine
Elongation 70

PU Adhesive Film

Structure _Top PU Film

Structure

Structure

Structure _Bottom PU Film

Structure

Structure

Features

  • Excellent wetting and non adhesion transfer
  • It has excellent chemical resistance and less odor, TVOC occurrence

Specifications

Properties Unit Standard Test Method
Thickness ㎛ 150±5 Thickness Gauge
Transmittance % 50±3 ASTM D1003
Haze % 50±4 NDH-5000
Surface Resistance Ω 50±5 Itself after hot press
Adhesive Strenght gf/inch 50±6 ASTM D3330
Heat Shrinkage % within 1.4 MD
within 0.6 TM