Product

We continue to expand line-up of our customized products including EMI shielding materials and thermal interface materials.

EMI Shielding Material Solution

Paste for spray

Product Overview

The application of EMI shielding materials is indispensable to obtain high performance of ultrathin mobile devices, and expanding to semiconductor packages, smartphones, displays, home network appliances, and automobiles due to improved materials and process technologies.

Ntrium has developed high conductive and high reliable materials for package-level EMI shielding, and has been approved for qualification and manufacturing by global chip maker and OSAT companies for the first time in the world.

Ntrium has secured the EMI shielding total solution that includes materials and process technologies based on years of steady research and development and accumulated technologies.

Characteristics and Merits

  • First-ever approved EMI shielding spray materials for semiconductor packages in the world.
  • Excellent properties such as shielding effectiveness, workability, adhesion and etc.
  • High stability and storage reliability for long hours working at room temperature

Technical Data Table

Products NES-F3-0371
Material Ag
Volume Resistivity (Ω·㎝) < 2.5 X 10-5
Viscosity (cps) 5,000
Cross-cut Test >5B
Curing Condition 60 min@60℃ / 30 min@150℃
Storage Temperature Room temperature
Lifetime 6 months

Application

> Flow diagram for package-level spray process

Tray loading&Units transfer to wafer-ring
Tray loading &
Units transfer to wafer-ring
Spray
Spray
Curing
Curing
Burr cleaning
Units transfer to tray again
  • > Cross-sectional FESEM image after spray

    Rear-side FESEM image after spray
  • > Measurement result for shielding effectiveness

    Measurement result for shielding effectiveness

Paste for dispensing

Product Overview

As the number of multi-chip package(MCP) increases, EMI shielding between chips in the same molding became necessary, which is called "compartment shielding." Ntrium also developed the compartment shielding material of high quality for dispensing as well as the conformal coating material for spray.

Characteristics and Merits

  • Outstanding electrical properties (≤ 2.0 x 10-4 Ω, cm), high adhesion to various substrates (>5B on EMC, Si sub, PI tape)
  • Convenient workability verified by dispensing equipment manufacturers and global OSAT

Application

> Longitudinal / Cross section image after dispensing

Horizontal / Vertical side cross section image after dispensing Horizontal / Vertical side cross section image after dispensing Horizontal / Vertical side cross section image after dispensing

Magnetic Paste

Product Overview

As the frequency bands of semiconductors have become more diverse, various kinds of EMI/EMC problems can be occurred and magnetic materials may be required in specific frequency range. Ntrium has world-class Emi shielding magnetic material for spray that has been verified from global chip maker and OSAT.

Characteristics and Merits

  • Excellent permeability (>80u@3MHz), high adhesion to various substrates (>5B on EMC, Si sub, PI tape)
  • Can be changed to sprayable hybrid material (conductivity + magnetic)

Magnetic Paste Other Material table

High-permeability
magnetic tape

Product Overview

In addition to the new concept EMI shielding material using spray process, Ntrium secures its own unique material technology to shield low/high frequency in the near field, and provides a customized solution considering the package design and board structure of customers.

Ntrium’s low frequency shielding material has been recognized of its world-class shielding capability, reliability, and process technology based on collaboration and evaluation from global leading companies.

Characteristics and Merits

  • Outstanding permeability rate (>700u@3MHz), high adhesion to various substrate (>5B on EMC, Si sub, PI tape)
  • Outstanding reliability that can be applied to semiconductor package process

* Available in roll or sheet form according to customer's specification

EMI Shielding Material for Automotive

Product Overview

Plastic housing shielding material used on ADAS sensor along with automotive semiconductor

The application of EM shielding materials is expanding to implement high-quality hardware due to ultra-thinning trends in mobile devices, including smartphones, and the development of related new materials and process technologies continues. In addition, with the recent increase in the adoption of automotive electrical components, vehicle-related demand for electromagnetic shielding materials is exploding. With years of continuous R&D and accumulated technology, the Ntrium has various kinds of shielding products for automotive.

Characteristics and Merits

  • Outstanding blocking performance and high adhesion with different kinds of board (>5B on EMC, Si sub, PI tape)
  • Outstanding convenience and storage stability that can be used on long-time work in room temperature

Line-up

Item Property Remark
Carbon-Black Ag Ag-Cu
Paste Appearance and Color Liquid / Dark Grey Liquid / Grey Liquid / Light Brown -
Acryl Adhesive Viscometer # Spindle 62 CP-51 CP-51 Brookfield DV2T
Viscosity (cps) @ 25℃ 2,300 ± 500 8,000 ± 1,500 11,000 ± 2,000
Solid Content (wt.%) 10 ± 2 72 ± 2 65 ± 2 150ºC 30min
Curing Condition 60 ºC ⅹ 30 min 60 ºC ⅹ 30 min 60 ºC ⅹ 30 min Convection Oven
After Curing Resistivity (ohm * cm) ≤ 2.0E-02 ≤ 5.0E-05 ≤ 1.5E-04 Micro-ohm meter
Cross-Cut test 5B 5B 5B 3M #610
Shelf Life 6 month @ 25℃ 6 month @ 5℃ 6 month @ 5℃ -

Application and Other Characteristics

> Replace aluminum housing with plastic + shield coating

Replace aluminum housing with plastic + shield coating

> Measurement result on shielding rate for each frequency after product application

Measurement result on shielding rate for each frequency after product application MHz Measurement result on shielding rate for each frequency after product application GHz

> Evaluation result on adhesion for each product

Carbon Black Ag Ag-Cu
Cross-Cut
> 5B
Carbon Black Ag Ag-Cu